Company
Press Release:
Ericsson and Texas
Instruments to Co-develop Innovative 3G Solutions for Handset Manufacturers
Bangalore (July 24, 2007)
-- Ericsson (NASDAQ:ERIC), the world’s leading telecom supplier, and
Texas Instruments Incorporated (TI) (NYSE:TXN), the global leader in silicon
solutions for wireless communications, today announced that the companies
will form a strategic technology engagement to develop custom solutions
for new Open OS enabled 3G devices.
Solutions from the technology
created by the two companies will combine small and power efficient 3G
modems from Ericsson Mobile Platforms with high-performance OMAP™ applications
processors from TI. Solutions from the joint engagement will include OMAP,
custom basebands and connectivity technologies and will be capable of supporting
the major Open OS, which offer easy access to a rich array of applications
and services. The result of this joint effort will enable all device
manufacturers to offer advanced Open OS handsets for both the high-end
and the rapidly growing mid-range market.
The collaboration between
Ericsson and TI will enable handset manufacturers to deliver the exciting
mobile entertainment and multimedia experiences that consumers around the
world are increasingly demanding. Ericsson’s access technology leadership,
current HSPA-enabled platforms, and future HSPA evolution and LTE technologies,
combined with the cutting-edge multimedia performance enabled by TI’s OMAP
2, OMAP 3 and future generations of OMAP processors, will continue to push
the performance boundaries of mobile devices and mobile entertainment features.
By leveraging TI’s OMAP
platform with Open OS support for Windows® Mobile, Symbian S60, Symbian
UIQ and Linux®, these solutions will provide OEMs and operators with
a robust and flexible architecture for applications and services deployment,
enabling easier delivery and management of services and content. This enables
handset manufacturers and mobile operators to differentiate their products
through rich, easy-to-use and customizable user interfaces, and through
a robust and flexible application architecture.
The result of the joint
effort will bring to market an evolving portfolio of wireless technology
platforms with Open OS support to reduce complexity, investment and time-to-market
for device manufacturers. The solutions, which seamlessly integrate the
modem and applications processor, will be presented in one pre-verified
and tested platform reference design. This approach will drastically reduce
development and verification efforts
previously undertaken
by device manufacturers, enabling customers to rapidly bring highly advanced
yet competitively priced products to market.
The joint solutions will
also benefit from the Ericsson Mobile Platforms IOT program, one of the
industry’s most extensive interoperability testing processes, guaranteeing
full compliance with operator requirements, speeding up time to market
and securing an easy roll-out of products.
Greg Delagi, senior vice
president of TI’s Wireless Terminals Business Unit, says: “It’s a tribute
to the long-standing collaborative relationship between EMP and TI that
we can tap into and combine each company’s unique wireless expertise in
order to deliver the most timely, targeted solutions to the market. TI’s
broad, proven product portfolio and advanced manufacturing capabilities
have continued to adjust to the demanding requirements of EMP’s customer
base. We believe that today’s announcement will build on what TI can bring
to EMP and what both companies together can bring to this vital, dynamic
industry.”
Robert Puskaric, head of
Ericsson’s mobile platforms’ unit, says: “Ericsson is clear in its commitment
to design and offer a portfolio of flexible, innovative mobile platforms
that address the requirements of the rapidly evolving mobile device market.
We are pleased to work closely with TI to combine the finest of each company’s
core wireless know-how – EMP’s access technology and platform size leadership
with TI’s innovative OMAP application processors in order to provide the
most capable Open OS platforms on the market today.”
Handsets based on these solutions
are expected to be available on the market in the second half of 2008.
Texas Instruments – Making
Wireless
TI is the leading manufacturer
of wireless semiconductors, delivering the heart of today's wireless technology
and building solutions for tomorrow. TI provides a breadth of silicon
and software and over 15 years of wireless systems expertise that spans
handsets and base stations for all communications standards, wireless LAN,
Bluetooth, A-GPS, mobile TV and Ultra Wideband. TI offers custom
to turn-key solutions, including complete chipsets and reference designs,
OMAP™ application processors, as well as core digital signal processor
and analog technologies built on advanced semiconductor processes.
Please visit www.ti.com/wirelesspressroom for additional information.
About Texas Instruments:
Texas Instruments Incorporated
provides innovative DSP and analog technologies to meet our customers’
real world signal processing requirements. In addition to Semiconductor,
the company includes the Education Technology business. TI is headquartered
in Dallas, Texas, and has manufacturing, design or sales operations in
more than 25 countries.
Trademarks
OMAP is a registered trademark
of Texas Instruments. All registered trademarks and other trademarks
belong to their respective owners