Bangalore, November 13, 2006: Furthering its commitment to accelerate wireless growth in India and high-growth markets worldwide, Texas Instruments Incorporated (TI) [NYSE:TXN] today announced that it will showcase its partnership with Sasken at the Texas Instruments Developer Conference (TIDC) India (Please visit ti.com/tidc/india2006 for more details) to be held on November 30th and December 1st 2006 at the NIMHANS Convention Centre, Bangalore. Sasken, one of TI’s leading application software providers, offers a scalable, integrated application suite to boost development of affordable multimedia feature phones.

Application suites from an ecosystem of leading software providers are integrated onto TI’s LoCosto single-chip value platform and OMAP-Vox™ multimedia product family for a highly customizable solution on mobile phones. TI’s customers can select an application suite such as Sasken’s ARIA, Motorola’s Ajar, OpenPlug’s ELIPS and SKY MobileMedia’s SKY-MAP™ that can be easily adapted to the unique needs of their handset products and specific operator and consumer requirements.

"Together with its ecosystem of application suite providers, TI is committed to helping its customers differentiate in the highly-competitive wireless market by providing a variety of solutions," said Remi El-Ouazzane, General Manager of TI’s 2.5G business for its Wireless Terminals Business Unit. "TI’s applications suite ecosystem provides multiple pre-integrated offerings based on selected superior solutions, resulting in flexible choices and faster time to market with customized, differentiated products."

The process of porting, validating and integrating software requires significant monetary and time investment. Texas Instruments is committed to helping customers maximize those investments by offering them a choice of pre-integrated application suites, simplifying the development process of mass market multimedia feature phones and reducing time to market by as much as six months. Each partner provides a unique modular and scalable offering based on a framework which allows development of multiple phone models for various market segments. This gives handset manufacturers the ability to add or remove applications to best address market and consumer needs. A common TI software foundation, built with open industry standard Application Programming Interfaces (API), enables software re-use and easy, consistent migration across TI’s LoCosto and OMAP-Vox^TM solutions.

In choosing its ecosystem application suite providers, TI thoroughly evaluates suppliers on multiple selection criteria including software architecture, scalability, breadth of application components, MMI customizability, robust worldwide engineering support and meeting operator grade compliancy. The result is that handset manufacturers can choose from a selection of proven, scalable solutions on TI’s "LoCosto" and OMAP-Vox^TM platforms for differentiated feature phone development.

Availability: Pre-integrated solutions from TI’s application ecosystem partners on the LoCosto platform are available today. Application suite solutions on OMAP-Vox^TM are expected to be available in the first quarter of 2007.

Texas Instruments – Making Wireless: TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow.  TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband.  TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP™ application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes. Please visit www.ti.com/wirelesspressroom for additional information.
 

Trademarks: OMAP-Vox^TM is a trademark of Texas Instruments. All other trademarks and registered trademarks are the property of their respective owners.